Xpedition training library will offer a complete portfolio of learning paths for schematic design, constraint definition, pcb layout, and library creation and management.
Learn how to place, route, verify and output a complete package for complex, single and multi-die high density advanced packages.
Learn how to place, route, verify and output a complete package for complex, single and multi-die high density advanced packages.
Learn co-design methodology that allows design teams to easily plan and optimize I/O and connectivity from a chip(s), through multiple packaging scenarios.
Learn co-design methodology that allows design teams to easily plan and optimize I/O and connectivity from a chip(s), through multiple packaging scenarios.
Learn the necessary process and individual step to use advanced packaging functionality including cavity creation, part stacking and wire bonding.
Learn the necessary process and individual step to use advanced packaging functionality including cavity creation, part stacking and wire bonding.
This learning path will focus on the Embedded Passive capability in Xpedition schematic and layout. Topics include library material and process setup.
This learning path will focus on the Embedded Passive capability in Xpedition schematic and layout. Topics include library material and process setup.
Receive unlimited access to all new content added during your active subscription.
During your subscription period, you will automatically receive access to all new content added to the library, including training on new product releases and technology updates to maximize your proficiency.