Xpedition
IC Package Design using Xpedition
Course Code
280142-US
Software
Xpedition vx2.12
Language
English
User Level
Advanced
Pricing ID
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Live Online Duration
6 hours for each day for 5 days
IC Package Design using Xpedition presents the workflow and methods of laying out a package design using the latest version of Mentor Xpedition Package Designer. From fundamental library concepts, to the package editor environment and the package layout process, you will gain hands-on experience in integrating a source netlist, placing and routing the board, and outputting the fabrication data.
PREREQUISITES
Prerequisites
- Familiarity with concepts of package technology
- Familiarity with Windows/Linux operating system
PROVIDED COURSE MATERIALS
Class Package
PRIMARY COURSE TOPICS
You Will Learn How To
- Use the interface (GUI) in an efficient and productive manner
- Start a Package Design by integrating with a netlist
- Place parts, Cavities and create part stacks
- Utilize Constraint Manager to define substrate and routing constraints
- Control visibility of Netlines
- Add Fanout vias and crankshafts
- Address wire bonding needs
- Route, using both manual/interactive and automatic tools
- Set, review, and repair routing tuning requirements
- Generate Plane data
- Verify the Package with online and batch Design Rule Checking
- Create all necessary documentation
- Examine library items