HyperLynx
HyperLynx Advanced Power Integrity (Modern UX)

Course Code
301056-US
Software
HyperLynx 2409
Language
English
User Level
Advanced
Pricing ID
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Live Online Duration
6 hours for each day for 3 days

Course Abstract

The HyperLynx Advanced Power Integrity Analysis course will help you meet the PI simulation needs that come with advanced technology requirements. You will master the use of HyperLynx Advanced Solvers for Decoupling analysis, which includes learning the PDN Decoupling Optimizer methodology that helps you create cost-efficient PDN designs. You will also learn to perform power-aware analysis and understand the requirements for simulation. Additionally, you will understand the need for thermal analysis and learn how to set up PI/Thermal Co-simulation.

PREREQUISITES

  • Familiarity with High-speed PCB design concepts
  • Familiarity with Windows operating system platform
  • HyperLynx Signal Integrity Analysis class and HyperLynx Power Integrity Analysis class

PROVIDED COURSE MATERIALS
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PRIMARY COURSE TOPICS

You will learn how to simulate advanced power integrity effects on your PCB and fix them early in the design cycle.

Hands-on lab exercises will reinforce lecture and discussion topics under the guidance of our industry-expert instructors.

What You’ll Learn

  • Create and simulate a Power Distribution Network (PDN) in the Hybrid Solver
  • Create time-efficient Hybrid Solver setup to boost productivity and maintain accuracy
  • Perform PDN sweep analysis using the 3D Explorer
  • Include on-package and/or on-die decoupling models in decoupling analysis
  • Perform the PDN Decoupling Optimizer flow
  • Setup decoupling capacitor libraries for PDN Decoupling Optimizer and learn the model syntax
  • Extract PDN and signal nets models
  • Perform time domain power-aware analysis in BoardSim and LineSim.
  • Run PI/Thermal Co-simulation and perform thermal what-if analysis

Throughout this course, extensive hands-on lab exercises provide you with practical experience using HyperLynx SI/PI and Advanced Solvers software. Hands-on lab topics include:

  • Using the Hybrid Solver to explore fast sweep options and efficiently distribute solver frequency points for decoupling analysis
  • Use the 3D Explorer to optimize decoupling capacitor placement
  • Set up the PDN optimizer for analysis to assess whether the baseline PDN is capable of producing a solution
  • Run the PDN Decoupling Optimizer expert system and limit the library scope to produce design guideline friendly solutions
  • Run the PDN Decoupling Optimizer Genetic Algorithm to produce multiple design candidates
  • Execute the PDN Decoupling Optimizer while including on-package and/or on-die decoupling models
  • Model non-ideal return paths in SI analysis using the 2D Field Solver and the Model Extractor
  • Create PDN models in LineSim for pre-layout power-aware analysis using the Advanced Decoupling Wizard
  • Perform PI/Thermal co-simulation and explore the impact of the thermal performance of the board on DC drop analysis and vice versa