Simcenter 3D
Simcenter 3D Electronic Systems Cooling
Software
Simcenter 3D 2022.1
Language
English
User Level
Beginner to Intermediate
Pricing ID
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List Price
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Price may not include taxes applicable to your billing region
Contact us for private event pricing
Contact us for private event pricing
Live In-Person Duration
5 Days
Live Online Duration
4 hours each day for 10 Days
The Simcenter 3D Electronic Systems Cooling course introduces thermal and flow capabilities to simulate 3D fluid flow and thermo-fluid behavior in densely packed, heat sensitive electronic systems. You will learn the skills necessary to build or modify geometry, create a finite element mesh, define thermal and flow boundary conditions, and perform sophisticated heat transfer and fluid analysis simulation processes focused on electronic systems. You will learn how to use the PCB Exchange application to collaborate with ECAD tools and perform PCA simulation analysis.
WHO SHOULD ATTEND
Designers, engineers who use Simcenter 3D Pre/Post to model heat transfer and fluid flow in electronics applications
PROVIDED COURSE MATERIALS
- Student Guide
- Activity Material
PRIMARY COURSE TOPICS
Day 1
- Introducing Simcenter 3D Pre/Post and electronic systems cooling analysis
- Heat transfer concepts and principles of fluid dynamics
- Preparing geometry for thermal and flow meshing
- Geometry idealization and fluid volume creation
Day 2
- Meshing for thermal and flow analyses
- Working with meshes
- Material and physical properties
- Modeling assemblies
Day 3
- Thermal boundary conditions
- Thermal couplings
- Radiation modeling
Day 4
- Flow boundary conditions
- Modeling flow surfaces and flow around a solid object
- Understanding the turbulence modeling
- Electronic thermal management
Day 5
- Setting up a solution
- Transient analysis
- Solving a model
- Post-processing results
- Temperature and pressure results mapping
- Using the PCB exchange application